Invention Application
- Patent Title: ENCAPSULATION STRUCTURE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
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Application No.: US16085421Application Date: 2018-01-26
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Publication No.: US20210175464A1Publication Date: 2021-06-10
- Inventor: Wei WANG , Jingkai NI
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN201710607002.0 20170724
- International Application: PCT/CN2018/074236 WO 20180126
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/32 ; H01L51/56
Abstract:
An encapsulation structure, a display panel and a manufacturing method thereof are provided. The display panel includes a base substrate; a device to be encapsulated on the base substrate; an encapsulation film on the base substrate, the encapsulation film covering the device to be encapsulated; and an edge encapsulation member on an edge of the encapsulation film, the edge encapsulation member being configured to cover the edge of the encapsulation film.
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