- 专利标题： MULTI-LEVEL FAN-OUT INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
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申请号： US17024182申请日： 2020-09-17
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公开(公告)号： US20210183779A1公开(公告)日： 2021-06-17
- 发明人: Bok Eng Cheah , Jackson Chung Peng Kong , Jenny Shio Yin Ong , Seok Ling Lim
- 申请人： Bok Eng Cheah , Jackson Chung Peng Kong , Jenny Shio Yin Ong , Seok Ling Lim
- 申请人地址： MY Bukit Gambir; MY Tanjung Tokong; MY Bayan Lepas; MY Kulim
- 专利权人： Bok Eng Cheah,Jackson Chung Peng Kong,Jenny Shio Yin Ong,Seok Ling Lim
- 当前专利权人： Bok Eng Cheah,Jackson Chung Peng Kong,Jenny Shio Yin Ong,Seok Ling Lim
- 当前专利权人地址： MY Bukit Gambir; MY Tanjung Tokong; MY Bayan Lepas; MY Kulim
- 优先权： MYPI2019007402 20191211
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/00 ; H01L21/50
摘要：
Disclosed embodiments include multi-level fan-out integrated-circuit package substrates that provide a low-loss path to active and passive devices, by shunting away from interconnects and inductive loops. The multi-level form factor of a molded mass, allows for the low-loss path.
公开/授权文献
- US11476198B2 Multi-level components for integrated-circuit packages 公开/授权日：2022-10-18
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