- 专利标题: SPINAL IMPLANT PACKAGING
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申请号: US17185027申请日: 2021-02-25
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公开(公告)号: US20210196443A1公开(公告)日: 2021-07-01
- 发明人: Leigh Anna Folger , David Mire , Caleb D. Smith , Christine Carmer Carmer
- 申请人: WARSAW ORTHOPEDIC INC.
- 申请人地址: US IN WARSAW
- 专利权人: WARSAW ORTHOPEDIC INC.
- 当前专利权人: WARSAW ORTHOPEDIC INC.
- 当前专利权人地址: US IN WARSAW
- 主分类号: A61F2/00
- IPC分类号: A61F2/00 ; A61F2/44
摘要:
A spinal implant package includes a tray having a body including spaced apart first and second cavities. The body includes a third cavity between the first and second cavities. The tray includes a first connecting feature that is movable relative to the body. A lid is coupled to the tray by a hinge. The lid includes a second connecting feature that is movable between a first position in which a bottom surface of the second connecting feature directly engages a top surface of the first connecting feature and a second position in which a top surface of the second connecting feature directly engages a bottom surface of the first connecting feature to provisionally fix the lid to the tray.
公开/授权文献
- US11707349B2 Spinal implant packaging 公开/授权日:2023-07-25
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