- 专利标题： LED ARRAY PACKAGE
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申请号： US17132325申请日： 2020-12-23
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公开(公告)号： US20210226104A1公开(公告)日： 2021-07-22
- 发明人: Vladimir ODNOBLYUDOV , Scott WEST , Cem BASCERI , Zhengqing GAN
- 申请人： BRIDGELUX, INC.
- 申请人地址： US CA Fremont
- 专利权人： BRIDGELUX, INC.
- 当前专利权人： BRIDGELUX, INC.
- 当前专利权人地址： US CA Fremont
- 主分类号： H01L33/56
- IPC分类号： H01L33/56 ; H01L33/46
摘要：
Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
公开/授权文献
- US11355680B2 LED array package 公开/授权日：2022-06-07
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