- 专利标题: POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POROUS POLYIMIDE FILM
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申请号: US16995146申请日: 2020-08-17
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公开(公告)号: US20210230367A1公开(公告)日: 2021-07-29
- 发明人: Tomoya SASAKI , Hidekazu HIROSE
- 申请人: FUJI XEROX CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: FUJI XEROX CO., LTD.
- 当前专利权人: FUJI XEROX CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2020-011366 20200128
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; C08L25/14 ; C08K5/41 ; C08K5/053 ; C08K7/16
摘要:
A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solution satisfies the following conditions (1) to (4), condition (1): a weight ratio (S1/S2) of the first organic solvent (S1) to the second organic solvent (S2) is from 50/50 to 90/10, condition (2): a HSP distance between the first organic solvent (S1) and the resin particle is 11 or more and less than 16, condition (3): a HSP distance between the second organic solvent (S2) and the resin particle is 16 or more, and condition (4): a HSP distance between the mixed solvent and the polyimide precursor is 12 or less.
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