发明申请
- 专利标题: HOUSING OF HIGH-SPEED TRANSMISSION CONNECTOR AND HIGH-SPEED TRANSMISSION CONNECTOR
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申请号: US17175165申请日: 2021-02-12
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公开(公告)号: US20210257771A1公开(公告)日: 2021-08-19
- 发明人: Takahiro SHIMOYAMA
- 申请人: Yamaichi Electronics Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Yamaichi Electronics Co., Ltd.
- 当前专利权人: Yamaichi Electronics Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: CN202010092843.4 20200214
- 主分类号: H01R13/50
- IPC分类号: H01R13/50 ; H01R12/71
摘要:
According to an embodiment, a housing of a high-speed transmission connector fitted to a connector of a counterpart substrate via a frontage. The housing of the first aspect includes: a bottom plate forming a bottom of the frontage and being provided with at least one boss on a surface opposite to the frontage side; a pair of first side walls facing each other in a first direction with the frontage sandwiched therebetween; and a pair of second side walls facing each other in a second direction orthogonal to the first direction with the frontage sandwiched therebetween. The bottom plate is provided with first through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the first side walls in the same planes and/or second through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the second side walls in the same planes.
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