- 专利标题： MULTI COMPONENT SOLID SOLUTION HIGH-ENTROPY ALLOYS
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申请号： US17184155申请日： 2021-02-24
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公开(公告)号： US20210260704A1公开(公告)日： 2021-08-26
- 发明人: Jianxun HU , Justin BROWN , Peiyong CHEN , Chanho LEE , Xuesong FAN , John William BOHLING , Carl D. LUNDIN , Peter LIAW , Zhenzhen YU , Abdelrahman ABDELMOTAGALY
- 申请人： Honda Motor Co., Ltd. , University of Tennessee Research Foundation , Colorado School of Mines
- 申请人地址： JP Tokyo; US TN Tennessee; US CO Golden
- 专利权人： Honda Motor Co., Ltd.,University of Tennessee Research Foundation,Colorado School of Mines
- 当前专利权人： Honda Motor Co., Ltd.,University of Tennessee Research Foundation,Colorado School of Mines
- 当前专利权人地址： JP Tokyo; US TN Tennessee; US CO Golden
- 主分类号： B23K35/30
- IPC分类号： B23K35/30 ; B32B15/01 ; C22C30/02 ; B23K11/20
摘要：
A multi-material component joined by a high entropy alloy is provided, as well as methods
公开/授权文献
- US11511375B2 Multi component solid solution high-entropy alloys 公开/授权日：2022-11-29
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