- 专利标题: ELECTRONIC DEVICE EQUIPPED WITH PRESSURE SENSORS
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申请号: US16319752申请日: 2017-07-21
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公开(公告)号: US20210294443A1公开(公告)日: 2021-09-23
- 发明人: Byeong-Cheol KIM , Han-Vit KANG , Jungwon KIM , Hyungsup BYEON , Ho-Kyung KANG , Jeongsik JEONG , Kwang-Tai KIM , Hyunju HONG
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2016-0092756 20160721,KR10-2017-0024702 20160721
- 国际申请: PCT/KR2017/007868 WO 20170721
- 主分类号: G06F3/044
- IPC分类号: G06F3/044 ; G06F3/041
摘要:
The present disclosure provides an electronic device equipped with a pressure sensor according to various embodiments. The electronic device may include: a housing including a first face facing a first direction and a second face facing a second direction opposite to the first direction, and including a conductive material provided on at least a portion of the second face; a touch screen display disposed between the first face and second face of the housing and exposed through the first face; a first pressure sensor disposed between the touch screen display and the second face of the housing and configured to sense pressure of an external object for the touch screen display; a second pressure sensor coupled to the second face of the housing and configured to sense pressure of an external object for the second face of the housing; and a support member spaced apart from the second face of the housing in the second direction. The second pressure sensor may include: a conductive pattern disposed between the support member and the conductive material; and a dielectric layer disposed between the conductive pattern and the conductive material. The second pressure sensor may be configured to generate an output on the basis of a change in capacitance associated with the conductive pattern, the conductive material, and the dielectric layer. Various embodiments may be possible for the pressure sensor.
公开/授权文献
- US11256347B2 Electronic device equipped with pressure sensors 公开/授权日:2022-02-22
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