- 专利标题: BULK-ACOUSTIC WAVE RESONATOR
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申请号: US16936807申请日: 2020-07-23
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公开(公告)号: US20210313954A1公开(公告)日: 2021-10-07
- 发明人: Seung Wook PARK , Jae Hyun JUNG , Jae Chang LEE , Dae Hun JEONG , Sang Uk SON , Seong Hun NA
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2020-0042080 20200407
- 主分类号: H03H9/13
- IPC分类号: H03H9/13 ; H03H9/17 ; H03H9/02
摘要:
A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.
公开/授权文献
- US11277113B2 Bulk-acoustic wave resonator 公开/授权日:2022-03-15
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