Techniques for liquid cooling systems are disclosed. In one embodiment, a hermetically sealed container includes an integrated circuit component and a two-phase coolant. As the integrated circuit component generates heat, the coolant boils, rising to a lid of the container. A cold plate mated with the lid absorbs heat from the lid, causing condensation of the coolant on the underside of the lid. The coolant then drips back down towards the integrated circuit component. Other embodiments are disclosed.