Invention Application
- Patent Title: DUAL-BACKPLANE STRUCTURE AND ELECTRONIC DEVICE USING SAME
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Application No.: US17239665Application Date: 2021-04-25
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Publication No.: US20210344131A1Publication Date: 2021-11-04
- Inventor: Yaxu CHEN , Yuan XUE
- Applicant: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Applicant Address: CN Shanghai
- Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Current Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Current Assignee Address: CN Shanghai
- Priority: CN202020694397X 20200429,CN2020103564849 20200429
- Main IPC: H01R12/72
- IPC: H01R12/72 ; G06F1/18

Abstract:
The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.
Information query