- 专利标题: FLOOR PANEL FOR FORMING A FLOOR COVERING
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申请号: US17391420申请日: 2021-08-02
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公开(公告)号: US20210355689A1公开(公告)日: 2021-11-18
- 发明人: Jan Eddy DE RICK
- 申请人: FLOORING INDUSTRIES LIMITED, SARL
- 申请人地址: LU Bertrange
- 专利权人: FLOORING INDUSTRIES LIMITED, SARL
- 当前专利权人: FLOORING INDUSTRIES LIMITED, SARL
- 当前专利权人地址: LU Bertrange
- 主分类号: E04F15/02
- IPC分类号: E04F15/02
摘要:
A floor panel arranged to be installed according to the fold-down principle, with a first pair and a second pair of edges. The second pair of edges coupling parts are arranged to be coupled to each other by a downward movement with two contact zones at opposite sides of a male part which fits into a female part. The ratio between the horizontal distance between the middle of the first contact zone and the middle of the second contact zone, and the vertical distance between the middle of the first contact zone and the middle of the second contact zone is more than 5, and/or wherein well-defined support points are applied.
公开/授权文献
- US11591807B2 Floor panel for forming a floor covering 公开/授权日:2023-02-28
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