- 专利标题: DISPLAY SUBSTRATE MOTHERBOARD, MANUFACTURING METHOD AND CUTTING METHOD THEREOF, DISPLAY SUBSTRATE AND DISPLAY DEVICE
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申请号: US16489441申请日: 2019-02-28
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公开(公告)号: US20210362467A1公开(公告)日: 2021-11-25
- 发明人: Lu LIU , Pao Ming TSAI , Shuang DU
- 申请人: BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 优先权: CN201810564551.9 20180604
- 国际申请: PCT/CN2019/076486 WO 20190228
- 主分类号: B32B7/023
- IPC分类号: B32B7/023 ; B32B7/12 ; B32B37/12 ; B32B37/18 ; B32B38/00 ; B23K26/38
摘要:
Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.
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