- 专利标题: PHOTORESIST DEVELOPER AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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申请号: US17246427申请日: 2021-04-30
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公开(公告)号: US20210364924A1公开(公告)日: 2021-11-25
- 发明人: Chen-Yu LIU , Ming-Hui WENG , An-Ren ZI , Ching-Yu CHANG , Chin-Hsiang LIN
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: G03F7/32
- IPC分类号: G03F7/32 ; H01L21/027 ; H01L21/308
摘要:
A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate and selectively exposing the photoresist layer to actinic radiation to form a latent pattern. The latent pattern is developed by applying a developer composition to the selectively exposed photoresist layer to form a pattern in the photoresist layer. The developer composition includes: a first solvent having Hansen solubility parameters of 18>δd>3, 7>δp>1, and 7>δh>1; an organic acid having an acid dissociation constant, pKa, of −11
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