Invention Application
- Patent Title: CAPACITY EXPANSION FOR MEMORY SUB-SYSTEMS
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Application No.: US17445258Application Date: 2021-08-17
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Publication No.: US20210373763A1Publication Date: 2021-12-02
- Inventor: Edward McGlaughlin
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
A memory sub-system includes a memory sub-system controller comprising at least one host channel, a memory device comprising a plurality of memory die, and at least one input/output (I/O) expander circuit coupled between the at least one host channel of the memory sub-system controller and to the memory device to connect the plurality of memory die to the memory sub-system controller. The at least one I/O expander circuit is to limit an impedance load presented on the at least one host channel to an impedance load of a corresponding subset of the plurality of memory die selected during a given time period.
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