A mold configuration for forming a pocket in a film comprising: a film support surface; a perimeter edge at said film support surface; wall surfaces inward of the perimeter edge defining a mold cavity; the wall surfaces including transition wall surfaces extending to a bottom wall surface; and a plateau surface inward of the perimeter edge. In one form, the perimeter edge includes sharp corner profile perimeter edge portions defining at least one sharp corner profile. A method of forming a pouch, includes using the disclosed mold configuration.