Invention Application
- Patent Title: METHOD FOR FABRICATING ELECTRONIC PACKAGE
-
Application No.: US17481610Application Date: 2021-09-22
-
Publication No.: US20220005786A1Publication Date: 2022-01-06
- Inventor: Lung-Yuan Wang , Feng Kao , Mao-Hua Yeh
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Priority: TW108119514 20190605
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/552 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L25/16 ; H01L25/00 ; H01L23/31
Abstract:
An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
Public/Granted literature
- US12009340B2 Method for fabricating electronic package Public/Granted day:2024-06-11
Information query
IPC分类:
