发明申请
- 专利标题: PACKAGING STRUCTURE FOR DISPLAY SUBSTRATE, PACKAGING METHOD AND DISPLAY DEVICE
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申请号: US17286263申请日: 2020-09-21
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公开(公告)号: US20220006053A1公开(公告)日: 2022-01-06
- 发明人: Zhen LI , Shasha ZHU , Yulin WANG , Rui HOU , Yide DU
- 申请人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Chengdu, Sichuan; CN Beijing
- 专利权人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Chengdu, Sichuan; CN Beijing
- 优先权: CN201910985655.1 20191017
- 国际申请: PCT/CN2020/116498 WO 20200921
- 主分类号: H01L51/52
- IPC分类号: H01L51/52 ; H01L51/56
摘要:
This disclosure provides a packaging structure for a display substrate, a packaging method and a display device. The packaging structure for the display substrate includes a base substrate, a light-emitting device arranged on the base substrate, and a packaging thin film covering the light-emitting device. The packaging thin film includes an inorganic thin film and an organic thin film that are laminated, and the organic thin film is arranged on a surface of the inorganic thin film away from the base substrate. The packaging thin film includes a central region and a peripheral region surrounding the central region, the inorganic thin film located in the central region has surface energy greater than that of the inorganic thin film in the peripheral region, and the organic thin film in the central region has a thickness less than that of the organic thin film in the peripheral region.
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