Invention Application
- Patent Title: PACKAGING MATERIAL FOR POWER STORAGE DEVICE
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Application No.: US17497402Application Date: 2021-10-08
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Publication No.: US20220029225A1Publication Date: 2022-01-27
- Inventor: Koji MURATA , Masayoshi SUZUTA
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-091943 20190515
- Main IPC: H01M50/129
- IPC: H01M50/129 ; B32B7/12 ; B32B15/088 ; B32B27/08 ; B32B27/20

Abstract:
A power storage device packaging material including a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, and a sealant layer in this order, wherein the substrate protective layer is made of a cured curable resin containing a plurality of types of particles having different average particle sizes, the curable resin contains a polyol component as a base resin and a polyisocyanate component as a hardener, and when, particles with a large average particle size are referred to as a large filler and particles with small average particle size are a small filler, the average particle size of the large filler is 10 μm or more, and the average particle size of the small filler is 1 μm or more, and an amount of the large filler is 3 mass % or more, and an amount of the small filler contained is 5 mass % or more.
Information query