发明申请
- 专利标题： SENSOR DEVICE
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申请号： US17415340申请日： 2020-02-04
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公开(公告)号： US20220057211A1公开(公告)日： 2022-02-24
- 发明人: Koichiro NAKASHIMA , Takashi UCHIDA , Yusuke NAKAMURA , Hideki UEDA , Naruhito NODA , Toshitsugu KONISHI , Toshio YAMAZAKI
- 申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 申请人地址： JP Osaka
- 专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址： JP Osaka
- 优先权： JP2019-019086 20190205,JP2019-098036 20190524,JPPCT/JP2019/027805 20190712
- 国际申请： PCT/JP2020/004060 WO 20200204
- 主分类号： G01C19/5783
- IPC分类号： G01C19/5783 ; G01C19/5684 ; B81B7/00
摘要：
A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
公开/授权文献
- US11885621B2 Sensor device 公开/授权日：2024-01-30
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