Invention Application
- Patent Title: LED BACKLIGHT STRUCTURE AND MANUFACTURING METHOD THEREOF
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Application No.: US17212832Application Date: 2021-03-25
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Publication No.: US20220057674A1Publication Date: 2022-02-24
- Inventor: Xianqin MENG , Weiting PENG , Yishan TIAN , Qiuyu LING , Yujiao GUO , Wei WANG , Fei WANG , Xiaochuan CHEN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN202010830087.0 20200818
- Main IPC: G02F1/13357
- IPC: G02F1/13357 ; G02F1/1335

Abstract:
The present disclosure relates to an LED backlight structure having a backlight side and a light outgoing side opposite to each other, including: an LED array on a transparent substrate; a transparent encapsulation layer on a side of the transparent substrate with the LED array, and configured to encapsulate the LED array; wherein the LED array is configured to emit light, the LED backlight structure further includes: a reflection layer on a backlight side of the transparent substrate and configured to reflect light to the light outgoing side; and a first microstructure layer on the light outgoing side of the transparent substrate and the LED array, wherein the first microstructure layer is configured to scatter light incident on a surface of the first microstructure layer, so that a part of light passes through the first microstructure layer, and the rest of light is reflected by the first microstructure layer.
Public/Granted literature
- US11262618B1 LED backlight structure and manufacturing method thereof Public/Granted day:2022-03-01
Information query
IPC分类: