- 专利标题: SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
-
申请号: US17394509申请日: 2021-08-05
-
公开(公告)号: US20220068684A1公开(公告)日: 2022-03-03
- 发明人: Eungjin KIM , Pyongil CHO , Hyeonjun JEON , Kyoungho KIM
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2020-0107971 20200826,KR10-2021-0005222 20210114
- 主分类号: H01L21/677
- IPC分类号: H01L21/677 ; H01L21/683
摘要:
A substrate processing system includes manufacturing process equipment including a plurality of process chambers and a control server configured to control the manufacturing process equipment. When a transporting order of semiconductor substrates is transmitted from the control server to the manufacturing process equipment, the control server provides, to the manufacturing process equipment performing an Nth process cycle (where N is a natural number) in a first transporting order, a command to switch to a second transporting order from an N+1th process cycle immediately when a restriction on at least one process chamber, into which insertion of the semiconductor substrate is restricted, is lifted.
公开/授权文献
信息查询
IPC分类: