Invention Application
- Patent Title: MEMORY MODULE FOR PROTECTION OF A CIRCUIT, A MEMORY MODULE PROTECTION DEVICE, AND A MEMORY MODULE PROTECTION SYSTEM
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Application No.: US17356940Application Date: 2021-06-24
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Publication No.: US20220070999A1Publication Date: 2022-03-03
- Inventor: DONGYOON SEO , SANGKEUN KWAK , DOHYUNG KIM , KYEONGSEON PARK , HWANWOOK PARK , WONSEOP LEE , DAAE HEO
- Applicant: SAMSUNG ELECTRONICS CO, LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0112634 20200903
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14
Abstract:
A memory module including: a first printed circuit board; a first socket and a second socket; and a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.
Public/Granted literature
Information query
