- 专利标题： Wafer-Level Passive Array Packaging
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申请号： US17005607申请日： 2020-08-28
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公开(公告)号： US20220071013A1公开(公告)日： 2022-03-03
- 发明人: Scott D. Morrison , Karthik Shanmugam , Raymundo M. Camenforte , Rakshit Agrawal , Flynn P. Carson , Kiranjit Dhaliwal
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L23/00
摘要：
Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.
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