Invention Application
- Patent Title: ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR PACKAGE
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Application No.: US17473746Application Date: 2021-09-13
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Publication No.: US20220081283A1Publication Date: 2022-03-17
- Inventor: Suguru HOCHI , Hideki TERASAWA , Shigeki SAKURAI
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya-city
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya-city
- Priority: JP2020-154596 20200915
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81B7/00 ; B81B7/02

Abstract:
An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.
Public/Granted literature
- US11691869B2 Electronic apparatus including semiconductor package Public/Granted day:2023-07-04
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