Invention Application
- Patent Title: SUSCEPTOR WAFER CHUCKS FOR BOWED WAFERS
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Application No.: US17029648Application Date: 2020-09-23
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Publication No.: US20220093443A1Publication Date: 2022-03-24
- Inventor: Abhishek Chowdhury , Vijayabhaskara Venkatagiriyappa , Mihaela A. Balseanu , Jyoti Prakash Deo , Srinivas Ramakrishna , Keiichi Tanaka , Mandyam Sriram , Francis Kanyiri Mungai , Mario D. Silvetti , Sriharish Srinivasan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/458 ; H01L21/687
Abstract:
Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.
Public/Granted literature
- US11581213B2 Susceptor wafer chucks for bowed wafers Public/Granted day:2023-02-14
Information query
IPC分类:
