Invention Application
- Patent Title: MULTI-HOP PHYSICAL LAYER DATA COLLECTION PROTOCOL
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Application No.: US17032450Application Date: 2020-09-25
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Publication No.: US20220103473A1Publication Date: 2022-03-31
- Inventor: Manish Talwar , Ajay Kachrani , Gert Grammel , Hao Wang , Tanweer Biswas
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H04L12/741
- IPC: H04L12/741 ; H04L12/751 ; H04L29/06

Abstract:
Disclosed embodiments utilize a layer three and/or layer four protocol to collect physical layer properties along a multi-hop network path between a source node and a destination node. The use of a layer three or layer four protocol provides an ability to span multiple links or networks between the source node and destination node, while also collecting the physical layer properties. Once physical layer properties along a network path can be understood, decisions relating to the configuration of the network path and/or whether to communicate via the network path are improved.
Information query