Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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Application No.: US17320711Application Date: 2021-05-14
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Publication No.: US20220115376A1Publication Date: 2022-04-14
- Inventor: Cheonbae Kim , Seungjin Kim , Dongkyun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-131281 20201012
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/78 ; H01L49/02

Abstract:
A semiconductor device is provided. The semiconductor device includes a plurality of lower electrodes arranged on a semiconductor substrate in a honeycomb structure; and a support connected to the plurality of lower electrodes and defining a plurality of open areas through which the plurality of lower electrodes are exposed. A center point of each of the plurality of open areas is arranged at a center point of a triangle formed by center points of three corresponding neighboring lower electrodes among the plurality of lower electrodes.
Public/Granted literature
- US11462543B2 Semiconductor device and method of fabricating the same Public/Granted day:2022-10-04
Information query
IPC分类: