Invention Application
- Patent Title: ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD ASSEMBLY
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Application No.: US17560689Application Date: 2021-12-23
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Publication No.: US20220117086A1Publication Date: 2022-04-14
- Inventor: Kyujin KWAK , Jinwoo PARK , Yonglak CHO , Jiwoo LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2019-0088178 20190722
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02

Abstract:
According to certain embodiments, an electronic device comprises: a housing including a first support member; a cover member coupled with and facing the first support member; a second support member coupled with and facing the first support member; a printed circuit board assembly disposed to face the first support member, the printed circuit board assembly having a part disposed between the first support member and the cover member and another part disposed between the first support member and the second support member; wherein the printed circuit board assembly comprises: a first circuit board including a first part disposed between the first support member and the cover member, and a second part disposed between the first support member and the second support member; a second circuit board disposed to at least partially face the first part and disposed between the first circuit board and the cover member; and an interposer board disposed to correspond to at least a part of an edge of the second circuit board and coupling the second circuit board with the first circuit board, and wherein the second support member biases a part of the edge of the second circuit board.
Public/Granted literature
- US12069804B2 Electronic device comprising printed circuit board assembly Public/Granted day:2024-08-20
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