- 专利标题: INJECTION MOLDING APPARATUS
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申请号: US17244613申请日: 2021-04-29
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公开(公告)号: US20220118664A1公开(公告)日: 2022-04-21
- 发明人: Vincenzo CICCONE , Hon Kee WU
- 申请人: Top Grade Molds Ltd.
- 申请人地址: CA Mississauga
- 专利权人: Top Grade Molds Ltd.
- 当前专利权人: Top Grade Molds Ltd.
- 当前专利权人地址: CA Mississauga
- 主分类号: B29C45/27
- IPC分类号: B29C45/27 ; B29C45/20
摘要:
An injection molding apparatus for receiving molten material from an injection nozzle and delivering the molten material to a mold cavity is disclosed. The injection molding apparatus includes a molten material conduit device for receiving the molten material and directing the molten material to a molten material receiver defined by a manifold, the manifold directing the molten material the mold cavity housed within the mold assembly of the apparatus. The molten material conduit device includes a manifold-sealed interface effector for sealing against the manifold, and a back plate engager for engaging the back plate that secures the molten material conduit device to the manifold. The manifold, the molten material conduit device and the back plate are cooperatively configured such that a discharge end of the conduit device is sandwiched between the manifold and the back plate and such that the discharge opening is disposed in alignment with the molten material-receiver.
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