Invention Application
- Patent Title: RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND ACOUSTIC WAVE DEVICE
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Application No.: US17646312Application Date: 2021-12-29
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Publication No.: US20220123728A1Publication Date: 2022-04-21
- Inventor: Syuichi ONODERA
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Priority: JP2019-129663 20190711
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03F3/24 ; H03H9/145 ; H03H9/64 ; H04B1/40

Abstract:
Reduced in size is a radio frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A radio frequency module includes a mounting substrate, a first radio frequency component, and an external connection electrode. The mounting substrate has a first main surface and a second main surface opposed to each other. The first radio frequency component has a signal terminal and a ground terminal. The first radio frequency component is provided on the second main surface. The external connection electrode is provided on the second main surface. The first radio frequency component has a third main surface and a fourth main surface opposed to each other. The signal terminal is provided on the third main surface. The ground terminal is provided on the fourth main surface.
Public/Granted literature
- US12176881B2 Radio frequency module, communication device, and acoustic wave device Public/Granted day:2024-12-24
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