Invention Application
- Patent Title: IMAGE SENSOR CONFIGURED TO IMPROVE ARTIFACT IN BINNING MODE
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Application No.: US17474740Application Date: 2021-09-14
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Publication No.: US20220124264A1Publication Date: 2022-04-21
- Inventor: Young Heub JANG , Kundong KIM , Sungsu KIM , Hyungwook KIM , Jiyun BANG , Hankook CHO , Jaehyuk HUR
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0135299 20201019
- Main IPC: H04N5/347
- IPC: H04N5/347 ; H04N5/369

Abstract:
An image processing device includes an image sensor including a pixel array that includes a first pixel group, and a correlated double sampling circuit. The first pixel group includes a first plurality of normal pixels, a second plurality of normal pixels, and at least one first phase detection pixel. The correlated double sampling circuit is configured to generate first video data, based on charges of the first plurality of normal pixels, generate second video data, based on charges of the second plurality of normal pixels, and generate first phase detection data, based on an output of the at least one first phase detection pixel. The image processing device further includes an image signal processor configured to apply a first weight to the generated first video data, and apply a second weight to the generated second video data.
Public/Granted literature
- US11785355B2 Image sensor configured to improve artifact in binning mode Public/Granted day:2023-10-10
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