- 专利标题: HOLLOW RESIN PARTICLES FOR THERMOSENSITIVE RECORDING MEDIA
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申请号: US17437923申请日: 2020-03-17
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公开(公告)号: US20220127478A1公开(公告)日: 2022-04-28
- 发明人: Koichi SAKABE , Katsushi MIKI
- 申请人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 申请人地址: JP Yao-shi, Osaka
- 专利权人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- 当前专利权人地址: JP Yao-shi, Osaka
- 优先权: JP2019-053535 20190320
- 国际申请: PCT/JP2020/011586 WO 20200317
- 主分类号: C09D11/107
- IPC分类号: C09D11/107 ; C08J9/14 ; C08J9/20 ; C08J9/232 ; B41M5/44 ; B41M5/42
摘要:
Hollow resin particles for thermosensitive recording media containing a thermoplastic resin shell and a hollow part surrounded by the shell. The hollow resin particles contain a thermally-vaporizable hydrocarbon in an encapsulation ratio of at least 0.2 wt %. The hollow resin particles preferably have a mean volume particle size ranging from 0.1 to 10 μm.