Invention Application
- Patent Title: ELECTRONIC DEVICE HOUSINGS WITH SHOCK ABSORBERS
-
Application No.: US17293213Application Date: 2019-07-11
-
Publication No.: US20220129039A1Publication Date: 2022-04-28
- Inventor: Cheng-Han Tsai , Kuan-Ting Wu , Chong-Wei Wu , Hung-Wei Wu
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/041272 WO 20190711
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B29C45/14
Abstract:
In one example, an electronic device housing may include a metal substrate defining an opening and a shock absorber in-mold molded with the metal substrate. Further, shock absorber may include a supporting portion formed on a surface of the metal substrate and a protruding portion that extends from the supporting portion through the opening. Further, the electronic device housing may include a metal layer disposed on the supporting portion.
Information query
