One embodiment of the present invention is a transparent sensing device comprising: a transparent substrate; a microsensor arranged on the transparent substrate and having an area of 250,000 μm2 or less; a plurality of wirings connected to the microsensor; and a sealing layer covering the microsensor arranged on the transparent substrate and the plurality of wirings. The sealing layer is a transparent resin having a water absorption rate of 1% or less after curing. Therefore, it is possible to provide a transparent sensing device in which migration of wirings is suppressed and which has excellent reliability.