Invention Application
- Patent Title: CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME
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Application No.: US17570500Application Date: 2022-01-07
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Publication No.: US20220132011A1Publication Date: 2022-04-28
- Inventor: Hyunsu JUN , Kihyun KWON , Seunghak LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0086978 20200714
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
Public/Granted literature
- US11563874B2 Camera module and imaging apparatus including the same Public/Granted day:2023-01-24
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