Invention Application
- Patent Title: INTERCONNECT DESIGN FOR JOINING DISSIMILAR MATERIALS
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Application No.: US17086701Application Date: 2020-11-02
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Publication No.: US20220133965A1Publication Date: 2022-05-05
- Inventor: Pankti N. Shah , John E. Hartung , Hailiang Zhao , Jason D. Hamack , Amanda Travis
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61M1/12
- IPC: A61M1/12
Abstract:
A connector block for an implanted coil of a transcutaneous energy transfer system (TETS) includes a plurality of closed slots sized and configured to receive corresponding conductors of a powerline of the implanted coil. A plurality of open slots is included. The connector block being sized and configured to be coupled to the implanted coil.
Information query
