Invention Application
- Patent Title: WATER-SOLUBLE FILM AND PACKAGE
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Application No.: US17574792Application Date: 2022-01-13
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Publication No.: US20220135301A1Publication Date: 2022-05-05
- Inventor: Minoru Okamoto , Sayaka Shimizu , Osamu Kazeto
- Applicant: KURARAY CO., LTD.
- Applicant Address: JP Okayama
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Okayama
- Priority: JP2019-131681 20190717
- Main IPC: B65D65/46
- IPC: B65D65/46 ; C08J5/18 ; B29C41/00 ; B29C41/46

Abstract:
There is provided a water-soluble film containing polyvinyl alcohol resin, wherein a ratio RSm (LD/TD) is 1.2 or greater and 2.5 or less, where the RSm (LD/TD) is the ratio of an average length RSm (LD) of roughness curve elements on at least one film surface in the longitudinal direction to an average length RSm (TD) of roughness curve elements on the same film surface in the transverse direction. This allows provision of a water-soluble film that can be suitably used for manufacturing a package with excellent uniformity of seal strength, even for manufacturing a package with excellent uniformity of seal strength during high-speed sealing; and a package using the film.
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