Invention Application
- Patent Title: RESIN COMPOSITION AND RESIN MOLDED BODY THEREOF
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Application No.: US17575896Application Date: 2022-01-14
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Publication No.: US20220135764A1Publication Date: 2022-05-05
- Inventor: Masaki Azuma , Yuki Sakai , Takahiro Kojima
- Applicant: TOKYO INSTITUTE OF TECHNOLOGY , KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY , CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo; JP Ebina-shi; JP Tokyo
- Assignee: TOKYO INSTITUTE OF TECHNOLOGY,KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY,CANON KABUSHIKI KAISHA
- Current Assignee: TOKYO INSTITUTE OF TECHNOLOGY,KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY,CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo; JP Ebina-shi; JP Tokyo
- Priority: JP2019-135114 20190723
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K9/06 ; C01G53/00 ; G02B7/02

Abstract:
The present invention aims to obtain a resin composition with low thermal expansion property by suppressing functional deterioration in negative thermal expansion property when a negative thermal expansion material is added to a thermoplastic resin and heat-processed. The present invention provides a resin composition including metal oxide particles and a thermoplastic resin, both having a negative thermal expansion property. The negative thermal expansion of the particles is attributed to a crystal phase transition, which is driven by electron transfer between the constituent metals, and a covalent protective layer that inhibits the electron transfer is formed between the particles and the thermoplastic resin.
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