Invention Application
- Patent Title: MULTILAYER CAPACITOR AND BOARD HAVING THE SAME
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Application No.: US17313300Application Date: 2021-05-06
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Publication No.: US20220139617A1Publication Date: 2022-05-05
- Inventor: Je Sik Yeon , Sun Hwa Kim , Eun Jin Shim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0145366 20201103
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/30 ; H01G4/12 ; H01G2/06 ; H05K1/11

Abstract:
A multilayer capacitor includes: a capacitor body including dielectric layers and first and second internal electrode layers and having first to sixth surfaces; and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively. The first internal electrode layer is divided into a 1-1-th internal electrode connected to the first external electrode and a 1-2-th internal electrode by a first space portion disposed at a position close to the sixth surface, and the second internal electrode layer is divided into a 2-1-th internal electrode connected to the second external electrode and a 2-2-th internal electrode by a second space portion disposed at a position close to the fifth surface, such that the fifth and sixth surfaces of the capacitor body are in an electrically opened state.
Public/Granted literature
- US11715598B2 Multilayer capacitor and board having the same Public/Granted day:2023-08-01
Information query