Invention Application
- Patent Title: ELECTRONIC SUBSTRATES HAVING HETEROGENEOUS DIELECTRIC LAYERS
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Application No.: US17085177Application Date: 2020-10-30
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Publication No.: US20220139792A1Publication Date: 2022-05-05
- Inventor: Joshua Stacey , Whitney Bryks , Sarah Blythe , Peumie Abeyratne Kuragama , Junxin Wang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/18 ; H01L23/31 ; H01L23/522

Abstract:
An electronic substrate may be formed having at least one dielectric layer that is heterogeneous. The heterogeneous dielectric layer may comprise three separately formed materials that decouple the critical regions within a dielectric layer and allow for the optimization of desired interfacial properties, while minimizing the impact to the bulk requirements of the electronic substrate.
Information query
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