An integrated circuit device includes a semiconductor substrate having components of a peripheral circuit structure formed in and on a surface of the semiconductor substrate. The peripheral circuit structure comprising a plurality of protective antenna diodes therein. A memory cell array structure is provided on at least a portion of the peripheral circuit structure. A charge accumulating conductive plate is provided, which extends between the peripheral circuit structure and the memory cell array structure. The conductive plate is electrically connected to current carrying terminals of the antenna diodes within the peripheral circuit structure. The conductive plate may have a generally rectangular planar shape with four corners, and the antenna diodes may be arranged into four groups, which extend between respective corners of the conductive plate and the semiconductor substrate.