Invention Application
- Patent Title: MICROMECHANICAL RESONATOR AND RESONATOR SYSTEM INCLUDING THE SAME
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Application No.: US17201576Application Date: 2021-03-15
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Publication No.: US20220140802A1Publication Date: 2022-05-05
- Inventor: Yongseop Yoon , Sungchan Kang , Cheheung Kim , Choongho Rhee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0145534 20201103
- Main IPC: H03H9/02
- IPC: H03H9/02
Abstract:
Provided is a micromechanical resonator including a support beam including a first portion supported on a support member and a second portion spaced apart from the first portion in a length direction of the support beam, and a piezoelectric sensing portion provided between the first portion and the second portion and connecting the first portion to the second portion.
Public/Granted literature
- US11973485B2 Micromechanical resonator and resonator system including the same Public/Granted day:2024-04-30
Information query
