A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.