The present disclosure provides systems and methods for a conductor assembly for an implantable lead cable. The conductor assembly includes a conductive element extending over an axial length from a proximal end to a distal end. The conductor assembly includes an inner dielectric layer coaxially covering the conductive element over the axial length. The conductor assembly includes an inner conductive layer coaxially covering the inner dielectric layer over the axial length, the inner conductive layer comprising a contiguous metal coating having a thickness in a range of 1 to 50 microns.