A resin composition has a viscosity of equal to or less than about 20 mPa·s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×105 Pa to about 3×105 Pa at about −20° C., and a storage modulus in a range of about 1.5×104 Pa to about 6×104 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.