Invention Application
- Patent Title: ERROR INJECTION METHODS USING SOFT POST-PACKAGE REPAIR (sPPR) TECHNIQUES AND MEMORY DEVICES AND MEMORY SYSTEMS EMPLOYING THE SAME
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Application No.: US17517107Application Date: 2021-11-02
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Publication No.: US20220147267A1Publication Date: 2022-05-12
- Inventor: Randall J. Rooney , Matthew A. Prather , Neal J. Koyle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
Methods for operating a memory system are disclosed herein. In one embodiment, a method comprises receiving first data to be written at a logical address of a memory array, storing the first data at a first physical address corresponding to the logical address, and remapping the logical address to a second physical address, for example, using a soft post package repair operation. The method can further include receiving second data different from the first data to be written at the logical address, storing the second data at the second physical address, and remapping the logical address to the first physical address. In some embodiments, the method can comprise storing first and second ECC data corresponding to the first and second data, respectively. The method can further comprise outputting the first data and/or the second ECC data in response to a read request corresponding to the logical address.
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Information query