Invention Application
- Patent Title: SENSING SUB-CIRCUIT, CIRCUIT, RECOGNITION METHOD, SENSOR, PANEL AND DEVICE
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Application No.: US17489605Application Date: 2021-09-29
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Publication No.: US20220147729A1Publication Date: 2022-05-12
- Inventor: Liang CUI , Lei WANG , Yangbing LI , Yubo WANG , Xiufeng LI , Yuanyuan MA
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN202011254729.3 20201111
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06F3/043 ; G06K9/03

Abstract:
The present disclosure provides a fingerprint sensing sub-circuit, a fingerprint sensing circuit, a fingerprint recognition method, a sensor, a touch display panel and a display device. The fingerprint sensing sub-circuit includes an acoustic wave generation circuit and an acoustic wave reception circuit. The acoustic wave generation circuit is configured to generate an ultrasonic wave. The acoustic wave reception circuit is configured to collect a voltage signal, convert the voltage signal into a current signal, and output the current signal to a signal output end. The acoustic wave generation circuit and the acoustic wave reception circuit are separated from each other, so that the fingerprint sensing sub-circuit operates in a mode where a transmitting operation and a receiving operation are separated from each other.
Public/Granted literature
- US11527095B2 Sensing sub-circuit, circuit, recognition method, sensor, panel and device Public/Granted day:2022-12-13
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