An endoscopic imaging instrument comprises an optical assembly and a sensor module coupled to the optical assembly. The sensor module comprises a plurality of electronic components and a seal member. The seal member includes an interior surface defining a hermetic cavity. The plurality of electronic components are positioned within the hermetic cavity. The seal member further includes an exterior surface and a wall extending between the interior surface and the exterior surface. The seal member further includes a plurality of connectors within the wall. Each connector of the plurality of connectors is configured to electrically connect with one or more electronic components of the plurality of electronic components.