Invention Application
- Patent Title: SOLDERING COMPONENT AND METHOD OF ASSEMBLING SOLDERING COMPONENT TO OBJECT
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Application No.: US17530473Application Date: 2021-11-19
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Publication No.: US20220152716A1Publication Date: 2022-05-19
- Inventor: TING-JUI WANG
- Applicant: TING-JUI WANG
- Applicant Address: TW New Taipei City
- Assignee: TING-JUI WANG
- Current Assignee: TING-JUI WANG
- Current Assignee Address: TW New Taipei City
- Priority: TW109140439 20201119,TW109146545 20201228
- Main IPC: B23K1/002
- IPC: B23K1/002 ; B23K1/00 ; B23K3/08 ; B23K3/02

Abstract:
The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.
Information query
IPC分类: